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Key points of technology in wireless binding

      Wireless binding does not use iron wire or wire, but glue the book block, which is a binding method from book publishing to automatic completion. The process flow is roughly as follows: the matching page enters the milling back, roughens the upper side glue.Key points of technology in wireless binding

     Coats the book back glue, covers the forming glue, cools the duplex slitting, cuts the finished products, stacks the finished products, checks and bundles the finished products.Key points of technology in wireless binding

Key points of technology in wireless binding

  Key points of technology in wireless binding 

     The finishing work before entering the plastic bag after the book page is a process that can not be ignored in the whole process of wireless binding. If the book after page matching enters the rubber bag if it is not finished in the finishing process, there will be many kinds of bad quality problems such as off page, loose page, empty ridge, wrinkle ridge and so on. Key points of technology in wireless binding

      Finishing is to bind the semi-finished Book stickers, put a certain number of book stickers on the binding machine, quickly block the two ends with plates, start the binding machine, compact the loose Book stickers and then bind them with ropes.Key points of technology in wireless binding

      In order to make the compacted spine stiff and solid, after compaction and binding, apply polyethylene glue on the bound book back again. After the polyvinyl alcohol glue is dried, loosen the binding rope, and then separate each book and transfer it to the glue bag.Key points of technology in wireless binding

 

       In wireless binding, milling back and roughing are the key processes. The milling back shall be determined according to the thickness of the paper and the number of folded layers. Generally, 1.4mm-3mm shall be milled, and the roughening depth shall be 0.8mm-1.5mm.Key points of technology in wireless binding

       If the depth of milling back and roughening is not enough, it will inevitably affect the penetration of glue, resulting in the quality defects of off page and loose page. If the book stickers are turned into the back milling without breaking through, uneven binding and compaction in the finishing process before gluing, the semi-finished products with such quality defects must have uneven back after being clamped by the book clip in the gluing machine.Key points of technology in wireless binding

      The milling cutter can’t reach the back, and the roughening depth of the back is not enough. The quality defects of glue impermeability, page peeling and loose pages mentioned above must exist. Therefore, if off page and loose page are found in the quality inspection after rubber packaging, while checking whether the milling back and roughening depth are appropriate, it is also necessary to check the processing quality of semi-finished products entering the processes such as page matching, binding and compaction.Key points of technology in wireless binding

 

       The binding part is on the spine and the side, and the hot melt adhesive used is also different. For example, the film model for the spine is h-970t, and the film model for the side is h-239t. The performance of the two is also different. The hot melt temperature is different. Whether it is appropriate or not is very important for the quality of binding and binding.Key points of technology in wireless binding

       The high temperature of the melt adhesive will make the melt adhesive too thin and insufficient viscosity, High melt temperature will make the glue too thick to penetrate and flow, and some will be attached to the ridge surface or side surface in small granular blocks, which will wrinkle the cover and empty the ridge. It is worth mentioning that at present, the properties of hot-melt adhesives produced by different manufacturers are also different (we have such experience from actual use). Key points of technology in wireless binding

     Taking the hot-melt temperature of hot-melt adhesives used in our factory as an example, some side adhesives have a temperature of 120 ℃, the hot-melt temperature of spine adhesives is 135 ℃, some side adhesives have a hot-melt temperature of 180 ℃ and the hot-melt temperature of spine adhesives is 200 ℃. Therefore, in order to ensure the gluing quality, we should master the appropriate process parameters according to the performance of the material.Key points of technology in wireless binding

      Generally, after gluing, the width of side glue coverage should be 4mm-5mm, and the spine glue can penetrate and fill the milling ditch. When the gluing is uneven, the gluing is too thin, and the supporting plate of the cover laminating machine is not replaced as required (or the height position is properly adjusted), the books after gluing are prone to empty ridges and wrinkled backs. This must be controlled and checked in the process of rubber coating.Key points of technology in wireless binding

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